Andy Heinig - RankMe

15 papers A 1C 1Journal 1Unranked 12

Year	Rank	Type	Title / Venue / Authors
2020	—	`conf`	13-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard. MWSCAS Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey
2020	—	`conf`	Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces. ICECS Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey
2019	—	`conf`	Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
2016	C	`conf`	Co-design of CML IO and Interposer channel for low area and power signaling. DDECS Muhammad Waqas Chaudhary, Andy Heinig
2016	—	`conf`	Interposer based integration to achieve high speed interfaces for ADC application. 3DIC Muhammad Waqas Chaudhary, Andy Heinig, Michael Dittrich
2015	—	`conf`	Current and future 3D activities at Fraunhofer. 3DIC Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber
2015	—	`conf`	Enabling automatic system design optimization through Assembly Design Kits. 3DIC Andy Heinig, Robert Fischbach
2014	—	`conf`	Design rule check and layout versus schematic for 3D integration and advanced packaging. 3DIC Robert Fischbach, Andy Heinig, Peter Schneider
2014	—	`conf`	Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache. MBMV Robert Fischbach, Michael Dittrich, Andy Heinig
2014	A	`conf`	System integration - The bridge between More than Moore and More Moore. DATE Andy Heinig, Manfred Dietrich, Andreas Herkersdorf, Felix Miller, Thomas Wild, Kai Hahn, Armin Grünewald, Rainer Brück, Steffen Krohnert, Jochen Reisinger
2013	—	`conf`	Layout dependent synthesis for manufacturing costs optimized 3D integrated systems. 3DIC Andy Heinig
2013	J	`jnl`	XML-Based Hierarchical Description of 3D Systems and SIP. IEEE Des. Test Susann Wolf, Andy Heinig, Uwe Knöchel
2011	—	`conf`	Multi-step approach for thermal optimization of 3D-IC and package. 3DIC Andy Heinig, Christoph Sohrmann
2010	—	`conf`	Integration of multi physics modeling of 3D stacks into modern 3D data structures. 3DIC Peter Schneider, Andy Heinig, Robert Fischbach, Jens Lienig, Sven Reitz, Jörn Stolle, Andreas Wilde
2006	—	`conf`	Zeitbeschränkte Clusterung zur Design-Space-Exploration geclusterter VLIW-Prozessoren. MBMV Andy Heinig, Mario Schölzel