André Zimmermann

22 papers Journal 22
YearRankTypeTitle / Venue / Authors
2025 J jnl
Review of MEMS Speakers for Audio Applications.
CoRR
Nils Wittek, Anton Melnikov, Bert Kaiser, André Zimmermann
2025 J jnl
SPICEAssistant: LLM using SPICE Simulation Tools for Schematic Design of Switched-Mode Power Supplies.
CoRR
Simon Nau, Jan Krummenauer, André Zimmermann
2024 J jnl
Meta-learning for few-shot sensor self-calibration to increase stress robustness.
Eng. Appl. Artif. Intell.
Patrick Tritschler, Torsten Ohms, Bin Yang, André Zimmermann
2024 J jnl
Product Development Processes for Individualized Products: A Case Study.
IEEE Trans. Engineering Management
Faruk Civelek, Alexander Brem, Karl-Peter Fritz, André Zimmermann
2023 J jnl
Review on Excess Noise Measurements of Resistors.
Sensors
Daniela Walter, André Bülau, André Zimmermann
2022 J jnl
Graph neural networks for parameter estimation in micro-electro-mechanical system testing.
Array
Monika Elisabeth Heringhaus, Alexander Buhmann, Jürgen Müller, André Zimmermann
2022 J jnl
Inkjet-Printed Temperature Sensors Characterized according to Standards.
Sensors
Jonas Jäger, Adrian Schwenck, Daniela Walter, André Bülau, Kerstin Gläser, André Zimmermann
2022 J jnl
Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference.
Sensors
Monika Elisabeth Heringhaus, Yi Zhang, André Zimmermann, Lars Mikelsons
2021 J jnl
Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor.
Sensors
Adrian Schwenck, Thomas Günther, André Zimmermann
2021 J jnl
Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane.
Sensors
Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann
2021 J jnl
Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning.
Sensors
Michael Haub, Martin Bogner, Thomas Günther, André Zimmermann, Hermann Sandmaier
2020 J jnl
Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques.
IEEE Trans. Instrum. Meas.
Alaa Fezai, Anuj Sharma, Wolfgang Müller-Hirsch, André Zimmermann
2020 J jnl
Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications.
Sensors
Martin Trotter, Daniel Juric, Zahra Bagherian, Nadine Borst, Kerstin Gläser, Thomas Meissner, Felix von Stetten, André Zimmermann
2020 J jnl
Quadrature Block for UHF Reflection Coefficient Measurements Using a Directional Coupler and Injection Locking.
IEEE Trans. Instrum. Meas.
Volker Kible, Robson Nunes de Lima, Karolinne B. Brito, André Bülau, André Zimmermann
2020 J jnl
Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns.
Robotics Comput. Integr. Manuf.
Benedikt Wigger, Ingo Koinzer, Thomas Meissner, Maximilian Barth, André Zimmermann
2019 J jnl
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation.
IEEE Access
Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, André Zimmermann
2019 J jnl
Application of human motion energy harvesters on industrial linear technology.
IET Wirel. Sens. Syst.
Lukas Lamprecht, Ricardo Ehrenpfordt, Tobias Zoller, André Zimmermann
2018 J jnl
Effect of Joule heating on the reliability of solder joints under power cycling conditions.
Microelectron. Reliab.
Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann
2018 J jnl
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.
Microelectron. Reliab.
Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann
2018 J jnl
Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB.
IEEE Access
Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann
2017 J jnl
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors.
Sensors
Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
2017 J jnl
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.
IEEE Trans. Reliab.
Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann