Alicja Lesniewska

15 papers Unranked 15

Year	Rank	Type	Title / Venue / Authors
2025	—	`conf`	Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. IRPS Alicja Lesniewska, Y. Fang, G. Delie, Philippe Roussel, Koen Van Sever, Emmanuel Chery, O. Varela Pedreira, Ivan Ciofi, S. H. Park, Zsolt Tokei, Kris Croes
2025	—	`conf`	Local Electric Field-Aware 3D TDDB Model for BEOL Reliability Predictions. IRPS Y. Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, I. De Wolf, Kris Croes
2024	—	`conf`	BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. IRPS Yu Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, Chen Wu, Victor Vega-Gonzalez, Ingrid De Wolf, Kris Croes
2024	—	`conf`	Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. IRPS Davide Tierno, Antonio Arreghini, Alicja Lesniewska, Y. Jeong, Marleen H. van der Veen, J. Stiers, N. Bazzazian, Ivan Ciofi, Geert Van den Bosch, Maarten Rosmeulen
2023	—	`conf`	Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
2022	—	`conf`	Degradation mechanisms in Germanium Electro-Absorption Modulators. IRPS Artemisia Tsiara, Alicja Lesniewska, Philippe Roussel, Srinivasan Ashwyn Srinivasan, Mathias Berciano, Marko Simicic, Marianna Pantouvaki, Joris Van Campenhout, Kristof Croes
2022	—	`conf`	First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. VLSI Technology and Circuits Gayle Murdoch, Matin O'Toole, Giulio Marti, Ankit Pokhrel, Diana Tsvetanova, Stefan Decoster, Shreya Kundu, Yusuke Oniki, Arame Thiam, Quoc Toan Le, Olalla Varela Pedreira, Alicja Lesniewska, Gerardo Martinez-Alanis, Seongho Park, Zsolt Tokei
2021	—	`conf`	Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes
2020	—	`conf`	Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes
2019	—	`conf`	Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. IRPS Alicja Lesniewska, S. A. Srinivasan, Joris Van Campenhout, Barry J. O'Sullivan, Kris Croes
2019	—	`conf`	Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects. IRPS Chen Wu, Adrian Vaisman Chasin, Andrea Padovani, Alicja Lesniewska, Steven Demuynck, Kris Croes
2018	—	`conf`	Insights into metal drift induced failure in MOL and BEOL. IRPS Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes
2018	—	`conf`	Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. IRPS Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf
2018	—	`conf`	Silicon Photonics for 56G NRZ Optical Interconnects. OFC Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil
2015	—	`conf`	Intrinsic reliability of local interconnects for N7 and beyond. IRPS Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Yves Saad, W. Gao