Alaa B. El-Rouby

12 papers C 3Journal 3Unranked 6
YearRankTypeTitle / Venue / Authors
2025 J jnl
Sectoring Approach for Performance Enhancement of MTT and Its Application on JPDA Algorithm.
IEEE Access
Mustafa Latif Cobankaya, Alaa B. El-Rouby
2015 — conf
Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays.
ICEAC
Kareem Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea Ismail
2015 J jnl
Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays.
Microelectron. J.
Karim Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea I. Ismail
2013 — conf
Current source based standard-cell model for accurate timing analysis of combinational logic cells.
ICECS
Mohamed Mahmoud, Amr Wassal, Alaa B. El-Rouby, Rafik Guindi
2013 C conf
TSV-based on-chip inductive coupling communications.
ISCAS
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
2012 C conf
A closed form expression for TSV-based on-chip spiral inductor.
ISCAS
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
2012 J jnl
An accurate power delivery system (PDS) design methodology for high-speed digital systems.
Int. J. Circuit Theory Appl.
Shaymaa M. Nabil, Alaa B. El-Rouby, Ahmed H. Khalil
2012 — conf
Effect of non-uniform substrate doping profile on the electrical performance of through-silicon-via for low power application.
ICEAC
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea Ismail
2012 — conf
Modeling and analysis of through silicon via: Electromagnetic and device simulation approach.
ICECS
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
2011 — conf
Body contact based TSV equalizer.
IDT
Khaled Mohamed, Alaa B. El-Rouby, Yehea I. Ismail, Hani F. Ragai
2011 C conf
Compact lumped element model for TSV in 3D-ICs.
ISCAS
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail
2011 — conf
Equivalent lumped element models for various n-port Through Silicon Vias networks.
ASP-DAC
Khaled Salah, Hani F. Ragai, Yehea I. Ismail, Alaa B. El-Rouby