| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
Development and evaluation of a modular experiential learning curriculum for promoting AI readiness.
Educ. Inf. Technol.
|
| 2022 | — | conf |
ICEEL
|
| 2022 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2003 | J | jnl |
J. Parallel Distributed Comput.
|
| 1996 | J | jnl |
Parallel Process. Lett.
|
| 1996 | J | jnl |
Inf. Sci.
|
| 1995 | J | jnl |
Int. J. High Speed Comput.
|
| 1995 | — | conf |
SPDP
|
| 1994 | J | jnl |
J. Supercomput.
|
| 1994 | — | conf |
PARLE
|
| 1994 | Misc | conf |
SAC
|
| 1993 | J | jnl |
J. Parallel Distributed Comput.
|
| 1992 | J | jnl |
Parallel Comput.
|
| 1992 | — | conf |
SPDP
|
| 1991 | C | conf |
ICCI
|
| 1991 | J | jnl |
IEEE Trans. Computers
|
| 1987 | J | jnl |
Inf. Process. Lett.
|