| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Comput. Aided Mol. Des.
|
| 2026 | J | jnl |
J. Comput. Aided Mol. Des.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | B | conf |
GLOBECOM
|
| 2022 | J | jnl |
IEEE Internet Things J.
|
| 2020 | B | conf |
IWCMC
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
J. Netw. Comput. Appl.
|
| 2018 | — | conf |
ICOIN
|
| 2017 | — | conf |
ICOIN
|
| 2016 | — | conf |
CloudNet
|
| 2015 | — | conf |
ENSsys@SenSys
|
| 2015 | J | jnl |
Comput. Electr. Eng.
|
| 2015 | C | conf |
ISCC
|
| 2015 | J | jnl |
Wirel. Pers. Commun.
|
| 2014 | B | conf |
ICPADS
|
| 2014 | B | conf |
PIMRC
|
| 2012 | J | jnl |
Simul.
|
| 2012 | — | conf |
Wireless Days
|
| 2010 | — | conf |
SpringSim
|
| 2009 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2008 | — | conf |
ICC
|
| 2008 | — | conf |
ICC
|
| 2004 | C | conf |
CIT
|